Effective and Low Energy Recycling Method for Solder Paste
نویسندگان
چکیده
منابع مشابه
Solder Paste Stencil for Surface Mount Technology
Solder paste masks or stenc.ils are an integral part of the manufacturing process for surface mount circuit boards. This study will examine the feasibility of developing a process for rapidly ' Currently at IUA-Tencor Corporation, San Jose, CA 0-7803-6482-1 /OO/$lO.OO 02000 IEEE 2000 IEEWCPMT Int'l Electronics Manufactluring Technology Symposium
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پلی کربنات یکی از پلاستیکهای مهمی است که به صورت گسترده در تولید لوحهای فشرده، قطعات رایانه، مواد ساختمانی و غیره مورد استفاده قرار می گیرد. این پلیمر بصورت عمده از تراکم مونومر بیس فنولa (bpa) و کربنیل کلرید یا دی متیل کربنات ها بدست می آید. در سالهای اخیر بازیافت شیمیایی پلی کربنات بیشتر مورد توجه بوده است. بازیافت شیمیایی پلی کربنات برای بدست آوردن مواد اولیه آن با روشهای متفاوتی مانند تجزی...
High Melting Lead-Free Mixed BiAgX Solder Paste System
Although lead-free soldering has been main stream in the industry since 2006 with the replacement of the eutectic SnPb system by the SnAgCu system, the development of drop-in lead-free alternatives for high melting high lead solder alloys is still far from mature. The BiAg alloy exhibits acceptable bulk strength, but very poor ductility and wetting. Therefore, it is not acceptable as an option....
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Solder paste is a homogeneous, stable suspension of solder powder particles suspended in a flux binder, and is one of the most important process materials today in surface mount technology (SMT). By varying the solder particle size, distribution and shape, as well as the other constituent materials, the rheology and printing performance of solder pastes can be controlled. Paste flow behavior is...
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ژورنال
عنوان ژورنال: Journal of The Japan Institute of Electronics Packaging
سال: 2012
ISSN: 1343-9677,1884-121X
DOI: 10.5104/jiep.15.164